Metal
plating (also known as electroplating or electrodeposition) is a coating
technology that deposits a thin later of a metal or alloy on a conductive
surface to impart particular functional or aesthetic properties. During the
plating process, the object to be plated functions as the positively charged
cathode while the desired plating material serves as the negatively charged
anode and source of the metallic ions that will form the final coating. Immersing
both materials in a bath or solution of electrolyte salts and adding an
electrical current causes an oxidation/reduction reaction on the surface of the
cathode where the metallic ions are deposited.
Scope of the Report:
This report focuses on the Plating for Microelectronics in
Global market, especially in North America, Europe and Asia-Pacific, South
America, Middle East and Africa. This report categorizes the market based on
manufacturers, regions, type and application.
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Market Segment by Manufacturers, this report covers
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria
and South Africa)
Market Segment by Type, covers
Electroplating
Electroless
Immersion
Market Segment by Applications, can be divided into
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
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There are 15 Chapters to deeply display the global Plating
for Microelectronics market.
=Chapter 1, to describe &Sheet1!$B$1& Introduction,
product scope, market overview, market opportunities, market risk, market
driving force;
Chapter 2, to analyze the top manufacturers of Plating for
Microelectronics, with sales, revenue, and price of Plating for
Microelectronics, in 2016 and 2017;
Chapter 3, to display the competitive situation among the
top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales,
revenue and market share of Plating for Microelectronics, for each region, from
2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by
countries, by type, by application and by manufacturers, with sales, revenue
and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and
application, with sales market share and growth rate by type, application, from
2013 to 2018;
Chapter 12, Plating for Microelectronics market forecast, by
regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Plating for
Microelectronics sales channel, distributors, traders, dealers, Research
Findings and Conclusion, appendix and data source.
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